 |
|||
|
|
|||
|
|
|||
| ||||||||||
|
|
 TM 750-245-4
Table 7-3. Workmanship - Continued
Indicator
Illustration
Cross-section good solder joint
A. A minimum amount of solder shall cover the top
of the conductor.
B. Wire, solder and terminal must be completely
fused at this point and wire must be adjacent to
terminal.
C. Entire mass consisting of terminal, wire and
solder must be free of all foreign substances.
D. Conductor wire (copper).
E. Terminal or printed circuit (PC) pad.
F. Smooth solder contour and proper filleting
action indicating required flowing and wetting
action.
Cross-section tubular connection
A. Slight protrusion is acceptable at weep hole.
B. Fillet from all sides of the solder cup.
C. Excess solder. Any solder on the outside
surface should be a thin film only.
D. Excess insulation gap, conductor not to bottom
of cup.
E. No fillet.
7-10
|
|
Privacy Statement - Press Release - Copyright Information. - Contact Us |
Click
here for thousands of PDF manuals