Section III. MAINTENANCE PROCEDURES
SCOPE OF GENERAL SUPPORT MAINTENANCE. General support maintenance of the RMHS Reference
Gyro Set is limited to the procedures specified in the maintenance allocation chart (Appendix B). This will include normal
housekeeping and cleaning of both the exterior and interior of the assemblage, and the performance of the preventive
maintenance checks and services listed in table 2-4. Defects that cannot be corrected must be reported to personnel at a
higher maintenance category. Records and reports of repair and preventive maintenance must be in accordance with
procedures in DA Pam 738-750.
Adequate ventilation should be provided while using TRICHLOROTRIFLUOROETHANE.
Prolonged breathing of vapor should be avoided. The solvent should not be used near
heat or open flame; the products of decomposition are toxic and irritating. Since
TRICHLOROTRIFLUOROETHANE dissolves natural oils, prolonged contact with the
skin should be avoided. When necessary, use gloves that the solvent cannot penetrate.
If the solvent is taken internally, consult a physician immediately.
a. Use a dry, lint-free cloth or brush to remove dust or dirt. If necessary, moisten the cloth with cleaning compound,
freon PCA, or TF. After cleaning, wipe dry with a dry cloth.
Compressed air shall not be used for cleaning purposes except where reduced to less
than 29 pounds per square inch (PSI) and then only with effective chip guarding and
personnel protective equipment. Do not use compressed air to dry parts when
TRICHLOROTRIFLUOROETHANE has been used. Compressed air is dangerous and
can cause serious bodily harm if protective means or methods are not observed to
prevent chips or particles (of whatever size) from being blown into eyes or skin of the
operator or other personnel.
b. Use a dust brush or fine paint brush to remove dust or dirt from the interior of the case and the exterior of the
modules. If necessary, use dry compressed air, not exceeding 29 PSI, to loosen and remove dirt and dust from
inaccessible spots in the case and around the modules.